KingConrail76
Active member
I prefer the * method: 4 thin lines criss-cross-wise. I just recently had to re-seat my cooler, due to CPU heating up after more overclocking. Found the old compound had dried up, and never even covered 1/3 of the CPU...
Which brings up 2 other, related issues:
1. Thermal Paste vs. Thermal Compound .. Paste is "glue", Compound is "not glue" .. Thermal Paste can cause the CPU to be pulled from the socket when trying to remove the cooler, where Compound does not "adhere" so grippy-like, and makes seperation much easier.
2. Hone your Heatsink! The reason, I found, that my compound had not spread over one full third of the CPU is that the heatsink base was not FLAT. A few minutes of honing on a piece of 1000 grit wet/dry paper on a piece of glass, and my CPU now runs a cool 50*C under load ..compared to bluescreening at 70*C+ prior.
Which brings up 2 other, related issues:
1. Thermal Paste vs. Thermal Compound .. Paste is "glue", Compound is "not glue" .. Thermal Paste can cause the CPU to be pulled from the socket when trying to remove the cooler, where Compound does not "adhere" so grippy-like, and makes seperation much easier.
2. Hone your Heatsink! The reason, I found, that my compound had not spread over one full third of the CPU is that the heatsink base was not FLAT. A few minutes of honing on a piece of 1000 grit wet/dry paper on a piece of glass, and my CPU now runs a cool 50*C under load ..compared to bluescreening at 70*C+ prior.